TCI’s FEP, PFA, ETFE, and cast PTFE fluoropolymer films posses a combination of excellent dielectric properties, chemical and temperature resistance, and weldability. These properties make our fluoropolymer films useful in many electrical applications, including circuit board laminates and high temperature insulation tapes for wire/cable wrapping. ETFE films/foils are used as release films for electronics, since they retain exceptional release abilities and moderate cushioning at high temperatures. ETFE films are also broadly used as cushioning/release media in Film Assisted Molding (FAM) processes of semiconductors and integrated circuits. TCI’s fluoropolymer films reduce release force when the integrated circuit is removed from the mold and increases productivity by removing the need to clean the mold between each use.